CALL FOR PAPERS (click here to download pdf form)
Here's your chance to be part of the 2010 EMCWA Conference. Opportunities are available for individual papers, panel discussions, keynotes, tutorial and workshop sessions.
| By participating in the EMCWA 2010 Conference, you can: |
| • |
Present a paper |
| • |
Share your knowledge |
| • |
Network with your peers |
| • |
Enhance your industry visibility |
Preference will be given to: hands-on success stories... unique projects that you've seen through to completion... technological innovations... industry updates... and solutions to common problems.
| Subjects can include: |
| Adhesive Bonding |
Dispensing Equipment |
| Automatic Coil Winding Systems |
ISO 9000 |
| Balancing Methods |
Magnet Wires |
| Coating and Impregnating |
Motor Components |
| Cost Saving Tips |
Motor Design & Assembly Technologies |
| Computer-Aided Manufacturing |
|
| Plus: |
| Magnetic Materials |
Taping Machines |
| Plastics and Resins |
Transformers |
| Quality Control |
Ultrasonic Bonding |
| Soldering Tools |
Wire Stripping |
Paper Specifications
Your paper must be original, unpublished, non-commercial and objective. Manuscripts selected for presentation will also be published on the EMCWA 2010 Proceedings Compact Disc. This Disc will be distributed to all EMCWA 2010 Conference attendees. Additional distribution includes EMCWA members, industry representatives, plus universities and libraries throughout the world. |
